Job title: Assembly Wirebond Process Engineer
Company: NXP Semiconductors
Job description: to Wire bond process in RF Assembly Partner with manufacturing and equipment team to support delivery, work on daily… production line issues, drive quality and operational excellence Responsible for process yield improvements and LOH reduction…
Expected salary:
Location: Kuala Lumpur
Job date: Thu, 27 Jun 2024 05:37:12 GMT
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