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Assembly Wirebond Process Engineer

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Job title: Assembly Wirebond Process Engineer

Company: NXP Semiconductors

Job description: to Wire bond process in RF Assembly Partner with manufacturing and equipment team to support delivery, work on daily… production line issues, drive quality and operational excellence Responsible for process yield improvements and LOH reduction…

Expected salary:

Location: Kuala Lumpur

Job date: Thu, 27 Jun 2024 05:37:12 GMT

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#Assembly #Wirebond #Process #Engineer

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