Bond

Job title: Senior Staff Engineer Equipment Die Bond Company: Infineon Job description: according to BE MNT methodology (NICA,PM Kits, OneSAP PM) Periodic review of maintenance scheduling via machine alarm analysis &MPFMEA… Expected salary: Location: Melaka Job date: Fri, 16 Aug 2024 02:30:21 GMT Apply for the job now! #Senior #Staff #Engineer #Equipment #Die #Bond